MINNEAPOLIS,
Minnesota, November 10, 2000
Plymouth, Minnesota based Honeywell Solid State Electronics Center
(SSEC) and Lowell, Massachusetts based RF Integration Inc. have
announced a product development alliance to develop a line of high
performance, low cost standard RFIC products for the Wireless and
Broadband Communication Industries. Using Honeywell SSECs µwave
CMOS SOI foundry and RF Integration¼s development capabilities,
these RFIC products will integrate digital and RF functions onto
single chips.
Honeywells
SOI technology takes advantage of high-yield silicon processing
and achieves high levels of RF, passive and digital integration
with low power dissipation. RF Integration, which operates as a
fabless semiconductor company, has expertise in the development
of high performance, high volume RFIC¼s.
The jointly
developed products will support the Wireless and Broadband marketplace
and focus on Infrastructure, Wireless Telephony, WLAN and WLL applications.
These products will be available in small outline plastic packages,
in prototype quantities first quarter 2001. Initial products will
include digital attenuators and high-isolation switches with integral
decoder drivers and logic functions. Customers have the option of
contracting with Honeywell for design, wafer fabrication, assembly,
and test services or of working directly with RF Integration during
the design phase.
For more details,
please contact Brian Groft (Business Development Manager) of Honeywell
SSEC at 410-964-4123 or brian.groft@honeywell.com, or Jean Luc Lembert
(VP Strategic Business Development) at RF Integration at 858-541-0239
or jllembert@rfintegration.com.
The Solid State
Electronics Center, located in Plymouth, Minn., develops and manufacturers
high reliability, high performance integrated circuits, sensors,
and electronic components for a variety of military, space, and
commercial applications. SSEC is part of Honeywell Space Systems.