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Description: |
Lead engineer
responsible for the product engineering of highly integrated RF IC
chipsets for the wireless communications markets.
Responsibilities include working with system and design engineering
to ensure the DFT (Design for Testability) for new products, test
lab management, creating and implementing product test plans, and
developing hardware and software for ATE platforms. |
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Experience: |
Candidate should
be highly proficient in the characterization of RF IC transceivers
and radio reference designs. Familiarity with measurement of gain,
noise figure, P1dB, IP3, IP2, phase noise, S-Parameters, IQ
mismatch, EVM, using bench test equipment (Agilent, R&S) is
required.
Candidate should
also have experience with test software development tools such as
Labview or Visual Basic and PCB design tools such as Orcad.
Familiarity with
commercial wireless communication standards such as 802.11, WiMax,
UWB,WCDMA and EDGE highly desirable
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